BOBST to bring market-leading insights to Corrugated 2026 conference

BOBST to bring market-leading insights to Corrugated 2026 conference

BOBST will bring its market-leading expertise of corrugated packaging to the first-ever Corrugated 2026 event, as it announces it will host four insightful speaking sessions at the show.

Interview with Dario Urbinati, CEO, Gallus Group

Interview with Dario Urbinati, CEO, Gallus Group

"Smart, connected printing was always about more than just adding digital functionality. It was, and remains, our roadmap for what the industry must become to stay competitive and sustainable"

BOBST readies digital label printers for regulatory challenges with compliant UV inkjet inkset

BOBST readies digital label printers for regulatory challenges with compliant UV inkjet inkset

BOBST is furthering its support for digital label printers and helping the market navigate complex compliance challenges with its Thalia UV Digital Inks, which are formulated and aligned with new regulations.

Xeikon Innovation Days 2026: Marking a New Chapter Under Flint Group Packaging Solutions

Xeikon Innovation Days 2026: Marking a New Chapter Under Flint Group Packaging Solutions

Flint Group Digital Xeikon today announced the return of Xeikon Innovation Days, taking place 9–10 June 2026 at its Global Innovation Center in Lier, Belgium, and one week later, on 16-18 June, at the Chicago Innovation ...

DuPont™ Cyrel® Flexographic Solutions opens new Customer Technology Center in North America and lunches Cyrel® ReNew

DuPont™ Cyrel® Flexographic Solutions opens new Customer Technology Center in North America and lunches Cyrel® ReNew

DuPont™ Cyrel® Flexographic Solutions, one of the world’s leading flexographic platemaking systems providers, announced it has opened its state-of the-art Customer Technology Center (CTC) at the DuPont Experimental Station in Wilmington. The new site reflects the ...

FESPA’s Inaugural Corrugated Event to Provide Dedicated Platform for Experts Across the Packaging and Display Industry

FESPA’s Inaugural Corrugated Event to Provide Dedicated Platform for Experts Across the Packaging and Display Industry

FESPA’s inaugural Corrugated event will take place at Gran Via, Fira de Barcelona, and will offer corrugated converters and manufacturers a focused platform to explore the latest innovations across the industry. From 19 – 22 ...

Navigating the new era of label regulations: how BOBST is helping converters to stay ahead

Navigating the new era of label regulations: how BOBST is helping converters to stay ahead

The labels industry is entering one of the most complex regulatory periods in its history. Authorities are tightening rules governing packaging sustainability, chemical safety, food contact materials, and product information. For converters and brand owners, compliance ...

HP Unveils New Innovations at Dscoop Edge Rockies to Unlock Profitable Growth for Print Service Providers 

HP Unveils New Innovations at Dscoop Edge Rockies to Unlock Profitable Growth for Print Service Providers 

At Dscoop Edge Rockies, HP unveiled new AI-driven software and press innovations designed to help commercial Print Service Providers (PSPs) unlock profitable growth through simplified operations, higher productivity and greater control across increasingly complex production environments. For HP, the future ...

Spotlight on packaging at FESPA’s Corrugated 2026 event

Spotlight on packaging at FESPA’s Corrugated 2026 event

This year, FESPA is launching a brand-new event called Corrugated, taking place at the Gran Via, Fira de Barcelona from 19–22 May, as part of FESPA 2026. Byline: Nick Kirby, FESPA Corrugated Ambassador and Non-Executive Director at ...

WrapFest 2026 To Spotlight Opportunities Across Wrapping Industry

WrapFest 2026 To Spotlight Opportunities Across Wrapping Industry

WrapFest 2026 (19 – 22 May 2026, Gran Via, Fira de Barcelona) is set to provide a platform for experts and professionals across the wrapping industry to exchange knowledge, discover the latest innovations and explore the ...

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